Wafer Cleaning

In semiconductor processing, although wet cleaning is a smaller segment of the semiconductor chip manufacturing industry, it still plays an important role. Wet processes can be used in cleaning, etching, and other steps in chip manufacture. Wafers may be cleaned and rinsed after initial wafer preparation.

The wafer cleaning process uses various chemicals and ultrapure water. Water and chemicals are injected from the nozzle located in the bath. The liquid should sufficiently go through the spaces between the arranged wafers in order to detach and remove the particles and impurities from the wafer surfaces.

In wet process, the nozzles made from highly corrosion-resistant materials play an important role. RELAB selects high-quality plastic materials, including PVDF, PCTFE or PTFE, which are effective against aggressive acids and organic solutions. Various shapes of nozzles can be customized according to wet process equipment and etching machines to meet various assembly requirements.